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2023 Executive Committee
2023 Technical Program Committee
D. Chen,
ASU, USA
J. Coignus,
CEA/LETI, France
X. Gong,
National U. of Singapore, Singapore
C. L. Hinkle,
Notre Dame U., USA
D. Jena,
Cornell U., USA
A. Khan,
Georgia Tech, USA
E. Lind,
Lund U., Sweden
C. Liu,
National Taiwan U., Taiwan
S. Migita,
AIST, Japan
M. Passlack,
TSMC, USA
R. Pillarisetty,
Intel, USA
J. Robertson,
Cambridge U., UK
T. Roy,
Duke U., USA
R. Timm,
Lund U., Sweden
W. Tsai,
Stanford U., USA
Y. Wu,
PKU, China
C. Yang,
Applied Materials, USA
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